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Huawei CH121L V3

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Huawei CH121L V3 is liquid cooling compute node which combines dense computing with an ultra-large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and High-Performance Computing (HPC).

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Compatible with

  • XenServer 7.0
  • XenServer 7.1 LTSR
  • XenServer 7.2
  • XenServer 7.3
  • XenServer 7.4
  • XenServer 7.5
  • XenServer 7.6

Compatibility

  • Citrix Hypervisor (XenServer)

Product Details

Huawei CH121L V3 is liquid cooling compute node which combines dense computing with an ultra-large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and High-Performance Computing (HPC).

It forms part of the CH100 and CH200 families of compute nodes, which are fully compatible with Huawei’s E9000 Blade Server. This efficient compute node features dynamic energy-saving and power-capping technologies that manage and control power consumption with remarkably reduced low-load operating power. Carrier-class design, manufacturing, and components ensure high quality.

Features

  • Intel® Xeon® processor E5-2600 v3/v4 family contain up to two 22-core processors to power each compute node
  • 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB
  • Reduces O&M costs with remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI, and IPMI 2.0 compliance
  • Nodes include efficient, secure power consumption analysis and control capabilities, including power-off mode, and Intel® NM 3.0 compliance
  • Supports board-level liquid cooling; adopts integrated cooling plates without internal solder points; 80% of heat dissipated through liquid; supports individually maintainable CPUs and memory modules